Abstract
Conventional rigid electronic systems use a number of metallization layers to route all necessary connections to and from isolated surface mount devices using well-established printed circuit board technology. In contrast, present solutions to prepare stretchable electronic systems are typically confined to a single stretchable metallization layer. Crossovers and vertical interconnect accesses remain challenging; consequently, no reliable stretchable printed circuit board (SPCB) method has established. This article reports an industry compatible SPCB manufacturing method that enables multilayer crossovers and vertical interconnect accesses to interconnect isolated devices within an elastomeric matrix. As a demonstration, a stretchable (260%) active matrix with integrated electronic and optoelectronic surface mount devices is shown that can deform reversibly into various 3D shapes including hemispherical, conical or pyramid.
Highlights
Conventional rigid electronic systems use a number of metallization layers to route all necessary connections to and from isolated surface mount devices using well-established printed circuit board technology
Stretchable electronics mostly remains limited to a single active layer with less complex device integration, which is primarily due to the lack of reliable manufacturing methods
Vertical interconnect accesses (VIAs) are required to interconnect between different active layers in the circuit boards, which is not well-established in the manufacturing process of stretchable electronics
Summary
Conventional rigid electronic systems use a number of metallization layers to route all necessary connections to and from isolated surface mount devices using well-established printed circuit board technology. This article reports an industry compatible SPCB manufacturing method that enables multilayer crossovers and vertical interconnect accesses to interconnect isolated devices within an elastomeric matrix. Conventional rigid printed circuit boards (PCB) typically consists of more than one metallization layers to route metal tracks to interconnect surface mount devices (SMDs) using wellestablished manufacturing methods, which is one of the main reasons behind the paramount success of this technology.
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