Abstract
This paper introduces and describes a new concept in multilayer ceramic capacitor (MLC) design which dramatically improves final microcircuit packaging density by incorporating buried capacitors in a multilayer ceramic interconnection substrate. This substrate, which is not conventional 94% alumina but a high K replacement, is compatible with conventional air firing thick film conductive, dielectric, and restrictive materials. Included is a discussion of substrate characteristics and potential custom thick film multilayer interconnections.
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