Abstract
The ability to create and process thin-film metal patterns directly on a multilayer ceramic (MLC) substrate has been demonstrated. The direct patterning of an MLC substrate with thin-film metallurgy enhances the substate by minimizing the number of layers required for device grid redistribution and increasing the device interconnection capability. It affords process simplification and good manufacturability as a result. The System 390-Air Cooled Thermal Conduction Module is a multidevice module with thin-film metallurgy that provides interconnection for a 10*10 device array in the test vehicle format and an 11*11 device array in the product format. The authors describe the thin film process. >
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