Abstract
Design, simulation and measurement results of the integrated compact up-converter MMICs (microwave monolithic integrated circuits) are presented and discussed. The design is performed to achieve low cost and high performance transmitter system for the Ka-band frequency applications. It is designed using anti- parallel diode pair sub-harmonic single sideband mixer and three stage RF (radio frequency) amplifler. Microstrip lines and lumped elements are used together to achieve a compact chip size. The layouts of the circuits are designed with careful EM (electromagnetic) simulations to avoid inter-component couplings and efiect of the microstrip bending discontinuities. The chip is operated for the wide bandwidth of the RF frequency from 22{38GHz. Due to sub-harmonic mixing the required local oscillator frequency (LO) is reduced to half (10{19GHz) to that of the RF frequency. The conversion gain of the chip is 9{ 15dB and Pi1dB output power is 7{12dBm. The single sideband and anti-parallel diode pair suppress the in-band unwanted sideband and second harmonic of the local oscillator (2LO), respectively. The suppression of sideband and 2LO signals is typically 20{35dB and 20{ 30dB, respectively. The size of the chip is as compact as 4.2mm 2 on a 100m-thick GaAs substrate.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
