Abstract
The integrated circuit package is a major cost and performance factor in high I/O count, high-speed integrated circuit packaging. 3M's Laminated MicroInterconnect (LMI) technology provides a unique solution for polymer based IC packaging using flip-chip or anisotropic conductive adhesive attachment. The basic LMI construction is discussed and contrasted with more conventional built-up multilayer approaches. Example design rules and routing capabilities are presented in the context of a 900 I/O, 35 mm IC packaging test vehicle. Environmental performance of this integrated circuit package with daisy chain and Kelvin structure test vehicles are also reviewed.
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