Abstract
The integrated circuit package is a major cost and performance factor in high I/O count, high-speed integrated circuit packaging. 3M's Laminated MicroInterconnect (LMI) technology provides a unique solution for polymer based IC packaging using flip-chip or anisotropic conductive adhesive attachment. The basic LMI construction is discussed and contrasted with more conventional built-up multilayer approaches. Example design rules and routing capabilities are presented in the context of a 900 I/O, 35 mm IC packaging test vehicle. Environmental performance of this integrated circuit package with daisy chain and Kelvin structure test vehicles are also reviewed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
