Integrated Circuit Fabrication — A Process Overview

Abstract

Complex processes and technology utilizing minute dimensions are essential to the fabrication of today’s high density integrated circuits. The key unit processes for circuit fabrication outlined within this paper are chemical vapor deposition, oxidation, diffusion and ion implantation, metallization and lithography. The parallel advances of these processes have led to a new era of very large scale integrated (VLSI) circuits with low micrometer to submicron features that result in denser, faster and more complex devices. The most critical advances, however, have been in the areas of lithography and etching, where electron-beam systems, along with plasma-assisted etching techniques, have enabled further miniaturization. New materials have been developed, including the low resistivity silicides. Packaging advances also translate into major production cost savings. Finally, the interaction of computer aided design, process simulation, production/process control, in-process measurement, characterization and final testing play a critical role in VLSI fabrication technology.