Abstract
Insulating metal substrates with a trilayer construction (an aluminum base plate, a thermally conductive epoxy dielectric layer, and copper conductor layer) have been evaluated for use in fabrication of power hybrid modules. Electrical (dielectric constant, dissipation factor, insulation resistance, and breakdown voltage) and mechanical (initial and aged copper adhesion, soldered adhesion, and large diameter aluminum wire bond strength) properties were evaluated. One-half of a MOSFET H-bridge, including drive circuitry, was fabricated to characterize the performance of the substrate. >
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