Insights into microstructure evolution and interface joining mechanism of ultrasonic spot welded Cu/Cu joint

Abstract

To understand the underlying microstructure evolution and joining mechanism of ultrasonic spot welded Cu/Cu joint, the microstructure and crystallography analysis were investigated. The grain size, grain boundary, misorientation angle, Kernel Average Misorientation, Schmid factor and crystal orientation along the weld thickness were heterogeneous and unsymmetrical. The changes of corresponding microstructural and crystallographic features were more obvious for the top sheet comparing with the bottom sheet. The {111} <110> texture, nano-sized equiaxed induced by discontinuous dynamic recrystallization and refined elongated grains because of continuous dynamic recrystallization were formed at the welding interface. The nucleated fine grains between the elongated grains attributing to continuous dynamic recrystallization were beneficial to the grain boundary migration and consequent the achievement of the interfacial metallurgical bonding.