Abstract
In this study, fatty alcohol polyoxyethylene ether (AEO-9) and isomeric decyl polyoxyethylene ether (XP-70, XP-90) are tested as additives to slurries, aiming to improve the surface quality during Si fine chemical mechanical polishing (CMP) in 14 nm ultra-large-scale integration. Large particle count, contact angle and polishing data reveal that, XP-90 exhibits improved dispersibility and hydrophilicity, reducing the roughness and defects. Various analytical results on silicon surfaces including X-ray photoelectron spectrometry, Fourier transform infrared spectrometry, and scanning electron microscopy data shed new light on the mechanism of the effects of polyoxyethylene ether on silicon CMP. And the surface roughness of Si is also optimized.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
