Abstract
In the near future, the next potential fast and large growing opportunity market will be the Internet of Things (IoT) and fifth generation (5G) connectivity application, due to the electronics industry is moved maturely on the mobile computing market for now. To meet the new application requirements & challenges, high-gain antennas have been proposed for wireless connectivity applications such as IoT and 5G product for high data transmission and low power consumption requirements. Differemt frequency transmission required to integrate an antenna in SiP module so that product designer can develop the products as compact as possible for specific application. This advanced technology will provide the integration solution for small form factor, high electrical performance, multi-function and low cost were the most popular requirements, the System in Package (SiP) is a combination of heterogeneous idea with semiconductor devices and passive components within one small package as system function module.In this paper, SPIL provided an alternative 3D small form factor SiP methodology will use surface mount technology (SMT) and 3D structure of stacking die on passives with antenna integration were designed to shrink the package size, the calculation of package size can be shrunk around 25% area and package size reduced from 16 x 12mm to 12 ×12mm. This new solution could be integrated an antenna inside SiP module as antenna in package (AiP) technology to get small form factor and additional major benefites to address cost, performance, and time-to-market.The characterization analysis will utilize typical reliability testing (Temperature Cycle Test, High Temperature Storage Test, unbias HAST) results as a verification for stacking die on passives integrated 3D antenna of SiP feasibility structure. Finally, this paper will find out the suitable 3D stacking die on passives of SiP structure and antenna integration solution for future IoT and 5G Connectivity devices application.
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