Innovative methodology to extract dynamic compact thermal models: Application to power devices

Abstract

This paper presents a new and innovative methodology for power components manufacturers to generate accurate boundary condition independent dynamic Compact Thermal Models (“BCI” DCTMs). The originality of this methodology is summarized by taking into account the thermal behavior of electronic components containing several cooling surfaces, and representing the non-linear properties of materials, while keeping a simple and recurring structure of generated models. Moreover, the proposed method makes it possible to obtain DCTMs with a limited number of measurements or 3D thermal simulations. The methodology to construct the DCTM is based on the construction of an equivalent thermal RC network. The precision of the RC thermal network is improved using variable resistances and capacitances related to the heat fluxes so that the compact model can adapt automatically with boundary conditions.