Abstract

Mechatronic solutions are progressively influencing innovative products from the most diverse range of applications. To ensure the optimum integration of mechanical, electronical and software components to form complete systems, modules are increasingly being based on flexible circuit carriers. Despite technological advantages, the use of foil based electronic circuits in main stream manufacturing has not arisen due to the absence of suitable production technologies. This article presents various concepts and prototype solutions to realize an economic process with the main focus on automated reel-to-reel manufacturing. The substrates are rigidly coupled in a panel during the paste application, assembly and reflow process steps and are separated at the end of the complete process sequence. This procedure requires both innovative systems and processes and new concepts for controlling the whole line.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.