Abstract
In the quest of low-stress M(O)EMS packaging, in this study, low-temperature adhesive bonding methodologies facilitated by inkjet printing technology were investigated. M(O)EMS devices contain fragile components and are very susceptible to external damages as well as thermal stresses. As to alleviate these stresses, integration of M(O)EMS devices at low processing temperature have been one of the critical requirements in the development of MOEMS packages. Given that, room or low-temperature die-attachments by using UV-curing for transparent substrates or UV-assisted hybrid approaches such as B-staging and shadow curing for opaque substrates are gaining significance. Inkjet printing of these adhesives is proposed here as a promising technique for M(O)EMS die-attachment; while controlled amount of adhesives jetted by a digital printer can mitigate several bonding-induced defects. Bond-line engineering of M(O)EMS die-attachments via inkjet printing is also introduced and further discussed.
Published Version
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