Abstract
Influence of the barrier layer on the electrical properties of V/Al-based Ohmic contact is investigated by comparing the surface morphology and alloying results of V/Al/Ni/Au (with barrier Ni) and V/Al/Cr/Au (with barrier Cr) contacts on n-AlGaN (Al molar fraction>60%) after 850 °C annealing. Due to the clustering of Ni during annealing, a thin Al layer (AlOx) and a number of Al-Au alloy clusters are formed at the contact interface of n-AlGaN, which increases the contact resistance of the V/Al/Ni/Au Ohmic contacts. In contrast, the annealed V/Al/Cr/Au electrodes cover the surface uniformly, which not only contributes to the increased contact area, but also suppresses the formation of high resistance products. Thanks to the Cr barrier layer, the specific contact resistivity of V/Al-based Ohmic contact is reduced by 26%.
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