Influence of the ambient temperature on the cooling efficiency of the high performance cooling device with thermosiphon effect

Patrik Nemec,Milan Malcho,P Dančová

doi:10.1051/epjconf/201818002073

Abstract

This work deal with experimental measurement and calculation cooling efficiency of the cooling device working with a heat pipe technology. The referred device in the article is cooling device capable transfer high heat fluxes from electric elements to the surrounding. The work contain description, working principle and construction of cooling device. The main factor affected the dissipation of high heat flux from electronic elements through the cooling device to the surrounding is condenser construction, its capacity and option of heat removal. Experimental part describe the measuring method cooling efficiency of the cooling device depending on ambient temperature in range -20 to 40°C and at heat load of electronic components 750 W. Measured results are compared with results calculation based on physical phenomena of boiling, condensation and natural convection heat transfer.

Highlights

The cooling device with heat pipe technology may be visualised as a long hollow pipe, bent and the ends joined to form a continuous loop, filled with working fluid and orientated in a vertical plane
The advantages that a cooling device with heat pipe technology enjoys over a conventional refrigeration system include: (1) absence of moving parts leading to a more reliable system operation, (2) increased choices for selecting a working fluid compatible with microelectronics chips since it does not have to go through a refrigeration cycle, (3) reducing the decomposition rate of the working fluid as the higher temperatures at the compressor discharge in a vapour compression refrigeration system are not encountered, (4) clean operation as no oil is circulated through the system
The cooling effectivity is expressed by ability of the cooling device to remove heat from the electronic element connected on the evaporator depending on the ambient temperature

Summary

Introduction

The cooling device with heat pipe technology may be visualised as a long hollow pipe, bent and the ends joined to form a continuous loop, filled with working fluid and orientated in a vertical plane. The advantages that a cooling device with heat pipe technology enjoys over a conventional refrigeration system include: (1) absence of moving parts leading to a more reliable system operation, (2) increased choices for selecting a working fluid compatible with microelectronics chips since it does not have to go through a refrigeration cycle, (3) reducing the decomposition rate of the working fluid as the higher temperatures at the compressor discharge in a vapour compression refrigeration system are not encountered, (4) clean operation as no oil is circulated through the system. In comparison to pool boiling systems employing vapour space condensation, a heat pipe technology offers more flexibility in terms of providing a centralized condenser with different feed lines to individual evaporator stations. With the addition of a liquid circulating pump in a cooling device,

Design of cooling device

Experiment

Mathematic calculation

Results and discussion

Conclusion