Abstract
This work deal with evaluation of condenser temperature by experimental measurement, calculation and thermal visualization of cooling device working with a heat pipe technology. The referred device in the article is cooling device capable transfer high heat fluxes from electric elements to the surrounding. One from many things influenced the heat flux amount transferred from electronic elements through the cooling device to the surrounding is condenser construction, its capacity and option of heat removal. The work contain description, working principle and construction of cooling device. Experimental part describe the measuring method and mathematical calculation to condenser temperature evaluation of cooling device depending on the loaded heat of electronic components in range from 250 to 750 W. The mathematical calculation is based on physical phenomena of boiling, condensation and natural convection heat transfer. The results of experimental measurement and mathematical calculation are verified by thermal imagining of device condenser by IR camera.
Highlights
The cooling device with heat pipe technology may be visualised as a long hollow pipe, bent and the ends joined to form a continuous loop, filled with working fluid and orientated in a vertical plane
This work deal with evaluation of condenser temperature by experimental measurement, calculation and thermal visualization of cooling device working with a heat pipe technology
The advantages that a cooling device with heat pipe technology enjoys over a conventional refrigeration system include: (1) absence of moving parts leading to a more reliable system operation, (2) increased choices for selecting a working fluid compatible with microelectronics chips since it does not have to go through a refrigeration cycle, (3) reducing the decomposition rate of the working fluid as the higher temperatures at the compressor discharge in a vapour compression refrigeration system are not encountered, (4) clean operation as no oil is circulated through the system
Summary
The cooling device with heat pipe technology may be visualised as a long hollow pipe, bent and the ends joined to form a continuous loop, filled with working fluid and orientated in a vertical plane. The advantages that a cooling device with heat pipe technology enjoys over a conventional refrigeration system include: (1) absence of moving parts leading to a more reliable system operation, (2) increased choices for selecting a working fluid compatible with microelectronics chips since it does not have to go through a refrigeration cycle, (3) reducing the decomposition rate of the working fluid as the higher temperatures at the compressor discharge in a vapour compression refrigeration system are not encountered, (4) clean operation as no oil is circulated through the system. In comparison to pool boiling systems employing vapour space condensation, a heat pipe technology offers more flexibility in terms of providing a centralized condenser with different feed lines to individual evaporator stations. With the addition of a liquid circulating pump in a cooling device, higher heat transfer coefficients associated with flow boiling systems could be realized [2]
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