Influence of substrate doping and point defects on Al and Ga interdiffusion in AlSb/GaSb superlattice structures

Abstract

Positron annihilation spectroscopy has been used to investigate the role of vacancies in the interdiffusion of Al and Ga in AlSb/GaSb superlattices. The samples were grown by metalorganic vapor-phase epitaxy on undoped and Te doped GaSb and consisted of ten periods of GaSb quantum wells (thickness 13 nm) and AlSb barriers (thickness 2–3 nm) and an approximately 50 nm thick capping layer of GaSb. The superlattices were annealed at 908 K for up to 250 s, resulting in interdiffusion of Al and Ga between well and barrier. A secondary ion mass spectrometry study showed that the Te dopant diffused from the substrate through the superlattice structure in the annealing process. In the positron annihilation study we observe that the vacancy concentration clearly decreases with annealing for the samples grown on undoped substrates, whereas the samples grown on Te doped substrates show a different annealing behavior.