Influence of silicon carbide filler on mechanical and dielectric properties of glass fabric reinforced epoxy composites

Abstract

AbstractFiber‐reinforced polymeric composites (FRPCs) have emerged as an important material for automotive, aerospace, and other engineering applications because of their light weight, design flexibility, ease of manufacturing, and improved mechanical performance. In this study, glass‐epoxy (G‐E) and silicon carbide filled glass‐epoxy (SiC‐G‐E) composite systems have been fabricated using hand lay‐up technique. The mechanical properties such as tensile strength, tensile modulus, elongation at break, flexural strength, and hardness have been investigated in accordance with ASTM standards. From the experimental investigations, it has been found that the tensile strength, flexural strength, and hardness of the glass reinforced epoxy composite increased with the inclusion of SiC filler. The results of the SiC (5 wt %)‐G‐E composite showed higher mechanical properties compared to G‐E system. The dielectric properties such as dielectric constant (permittivity), tan delta, dielectric loss, and AC conductivity of these composites have been evaluated. A drastic reduction in dielectric constant after incorporation of conducting SiC filler into epoxy composite has been observed. Scanning electron microscopy (SEM) photomicrographs of the fractured samples revealed various aspects of the fractured surfaces. The failure modes of the tensile fractured surfaces have also been reported. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009