Abstract
The emergence of micro and nano-based inorganic oxide fillers with optimal filler-loadings further enhances the required insulation characteristics of neat epoxy. During manufacturing and service application, insulators and dielectrics face mechanical stresses which may alter their basic characteristics. Keeping this in mind, the facts’ influence of mechanical stresses and fillers on dielectric properties of polymeric insulators of two epoxy/silica composites were fabricated and thoroughly analyzed for dielectric characteristics under ramped mechanical compressions relative to the unfilled sample. Before compression, epoxy nanocomposites exhibited responses having an average dielectric constant of 7.68 with an average dissipation factor of 0.18. After each compression, dielectric properties of all samples were analyzed. The dissipation factor and the dielectric constant trends of each sample are plotted against a suitable frequency range. It was observed that after the successive compressions up to 25 MPa, the dielectric properties of epoxy micro-silica composites were highly affected, having an average final dielectric constant of 9.65 times that of the uncompressed sample and a dissipation factor of 2.2 times that of the uncompressed sample, and these were recorded.
Highlights
Polymeric insulators and dielectrics have been extensively utilized in electrical insulation and dielectric applications due to their superior properties over the conventional ceramic insulators, such as light in weight, flexibility in nature, ease of installation, low maintenance, low cost, higher tensile strength, and higher dielectric strength [1,2,3]
Shen et al [9] conducted a study on dielectric properties of SnO2 under high pressure and found that the dielectric constant and loss tangent decreased with increasing frequency
Keeping in mind the above motivation, the purpose of this study is to explore the dielectric response of epoxy–silica nano and microcomposites, as well as their impact on multiple increasing successive compressions
Summary
Polymeric insulators and dielectrics have been extensively utilized in electrical insulation and dielectric applications due to their superior properties over the conventional ceramic insulators, such as light in weight, flexibility in nature, ease of installation, low maintenance, low cost, higher tensile strength, and higher dielectric strength [1,2,3]. Mechanical stresses significantly influence the dielectric properties of polymeric dielectrics [5,6]. Ramy et al studied the effect of mechanical stresses on polymeric-insulating materials and concluded that electric field strength decreased significantly due to mechanical stresses. Shen et al [7] studied the impact of hydrostatic compression on nano carbon-filled epoxy composites and deduced a decrease in electrical resistance due to decrement in the tunneling gap. Khattak et al [8] studied the dielectric behavior of epoxy silica micro and nanocomposites at 15 MPa pressure. It was concluded that compression increased the dielectric constant and dissipation factor of all the composites. Shen et al [9] conducted a study on dielectric properties of SnO2 under high pressure and found that the dielectric constant and loss tangent decreased with increasing frequency
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