Abstract
AbstractIn order to improve the heat dissipation of the electrical components, a curved tiered microchannel heat sink (TMCHS) was proposed and optimized and applied to cool the electrical components together with nanofluids. Influence of channel radian (φ = 0°, 75°, 135°, 180°), arc number (n = 0, 2, 3, 4), and nanoparticle concentration (w = 0.0%, 0.1%, 0.3%, 0.5%) on flow and heat transfer characteristics of nanofluids in curved TMCHS was numerically investigated. Comprehensive evaluation coefficient comprehensive evaluation factor (PEC) was used to evaluate the thermo‐hydraulic performance of TMCHS and nanofluids. Results indicated that the greater the radian and arc number, the better the thermal performance of TMCHS. The overall performance of TMCHS is the best when the radian is 180° and the arc number is 4. Results in this paper provide important technical guidance for the application of curved tiered microchannel heat sinks and nanofluids to the field of thermal management of electronic components.
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