Abstract
In this study, the effects of multi-walled carbon nanotubes on the melting temperature and microstructural evolution of the Sn-5Sb/Cu joints are evaluated. Plain and carbon nanotubes (CNTs) reinforced Sn-5Sb solder systems with solder formulations Sn-5Sb, Sn-5Sb-0.01CNT, Sn-5Sb-0.05CNT and Sn-5Sb-0.1CNT were prepared through the powder metallurgy route and thereafter samples were subjected to thermal and microstructural evaluation. As retrieved from the DSC scans, a slight decline in the peak temperature was observed in the composite solders which is indicative of the CNTs role in exciting surface instability in the host Sn matrix. In order to prepare the solder joints and analyze the interfacial intermetallic compound (IMC) evolution, respective solder systems were placed on copper (Cu) substrate and subjected to both reflow soldering and isothermal aging (170°C) conditions. From the IMC thickness result, considerable retardation in the IMC layer growth was observed in the CNTs reinforced solder joints, especially the 0.05wt.% CNTs solder system owing to the inhibition of Sn atoms diffusion by reinforcement material.
Highlights
The effects of multi-walled carbon nanotubes on the melting temperature and microstructural evolution of the Sn-5Sb/Cu joints with solder formulations (Sn-5Sb-xCNT; 0, 0.01, 0.05 and 0.1 wt.%) was evaluated
The melting temperature results indicate that the presence of carbon nanotubes addition to the solder matrix lead to a marginal decrease in the peak temperature of the composite solders due to high surface free energy of MWCNTs in the solder matrix
From the IMC thickness data retrieved, it was observed that the composite solders showed better results for all subjected conditions as compared with the plain solder and the most appreciable IMC layer suppression was detected across board in the 0.05wt.% CNTs reinforced solder system
Summary
The effects of multi-walled carbon nanotubes on the melting temperature and microstructural evolution of the Sn-5Sb/Cu joints with solder formulations (Sn-5Sb-xCNT; 0, 0.01, 0.05 and 0.1 wt.%) was evaluated.
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