Abstract
The influence of minor POSS (polyhedral oligomeric silsesquioxanes) molecules additions on the microstructure and hardness of SnAgCu–xPOSS (x = 1, 3 and 5) was investigated. A mechanical mixture method was adopted by adding POSS molecules as dispersoids into SnAgCu solder to fabricate SnAgCu–xPOSS composite solders. The microstructural evolution and the hardness of the solders were investigated in details by microstructural observations, Vickers hardness tester and nanoindentation tests. The results showed that the effects of the dispersed POSS molecules in eutectic SnAgCu structure and the refined Ag3Sn IMC particles increased the hardness of eutectic SnAgCu phase and then increased the hardness of composite solder. In addition, because of the agglomeration of POSS molecule, a coarse lath-shaped structure (composed of POSS molecules, Ag3Sn phase and minor Cu6Sn5 phase) formed in SnAgCu–5POSS solder matrix, which reduced the hardness of SnAgCu–5POSS solder.
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