Abstract
In the field of oxide semiconductor thin-film transistors (TFTs), the occurrence of charge trapping in the gate dielectric and interfaces presents significant challenges to their operational stability and reliability. In this study, we present high-performing amorphous Ga2O3 TFTs created using atomic layer deposition with varying indium doping concentrations. The channel length (Lch) and channel width (Wch) are 50 and 200 μm, respectively. As the Indium concentration increases from 0% to 60%, the charge trap density (Nit) decreases, resulting in a smaller hysteresis window. The TFTs with a doping concentration of 20% are particularly noteworthy, exhibiting high field-effect mobility (22.6 cm2 V−1 s−1), lower subthreshold swing (160 mV/dec) than amorphous Ga2O3 channel devices, a high on-off current ratio (109), an appropriate threshold voltage (−1 V), and a substantial output current (26 mA/mm at VGS = 16 V).
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