Influence of deposition pressure on microstructure, mechanical and electrical properties of niobium thin films

Abstract

Niobium (Nb) thin films were deposited on a Si substrate using magnetron sputtering system by varying the deposition pressure. The effect of deposition pressure on the microstructure, residual stresses, and electrical properties was investigated by systematically varying the deposition pressure from 0.15 to 0.60 Pa. The Nb thin films were characterized using hard x-ray reflectivity, grazing incidence x-ray diffraction, four point probe method, and atomic force microscopy. The films grown at lower deposition pressures had smooth surfaces and more compact structures, which are advantageous for lowering electrical resistance but had higher compressive stress. On the other hand, the films grown at higher deposition pressures had columnar type growth with less dense structures, which leads to increase in electrical resistance. However the nature of stresses transform from compressive to tensile. Hard X-ray reflectivity performed on Nb films provides direct insight into the growth and the microstructure which were correlated with the mechanical and electrical properties.