Abstract
AbstractAn investigation is presented into how the presence of low concentrations of chloride (<100 ppm) influences the type of pattern of deposit formed on 6063 aluminium alloy when it is exposed to dilute (1–35 ppm) solutions of copper sulphate. In situ visual observations, supported by ex situ energy dispersive spectrometry (EDS) measurements, revealed that, in the absence of chloride, copper deposition on to aluminium appears to occur predominantly in the form of dendrites, while chloride promotes more uniform deposition. The resulting effect of the deposited copper on the corrosion rate of aluminium was assessed by the linear polarisation resistance technique (LPR). The location at which the copper was deposited was a compromise between oxygen availability and passive film thickness. This means that pits associated with copper deposition can occur in regions different from that expected from simple potential distribution and mass transport considerations. If the aluminium forms a stable passive oxide...
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