Influence of charge traps on charge plasma-germanium double-gate TFET for RF/Analog & low-power switching applications

Abstract

The device reliability on account of charge traps at the Al2O3/Ge interface is a main distress for the Ge-based Tunnel Field Effect Transistor (TFET). Here, the influence of Interface Trap Charges (ITC) on the charge plasma-based Ge-Double-Gate TFET (CP-Ge-DGTFET) and conventional Ge-DGTFET's DC, Analog/RF, and linearity characteristics have been inspected using technology-computer-aided-design (TCAD) simulations for the donor (positive) and acceptor (negative) ITC. The charge plasma concept is adopted to induce excess carrier concentration within the source region on the integration of optimum work function metal electrodes. To recognize the impact of ITC, several figures of merits have been investigated, such as transfer characteristics, electric field, transconductance, cut-off frequency, parasitic capacitance, and linearity performance parameters (VIP2, VIP3, IIP3, and IMD3). The CP-Ge-DGTFET device structure revealed superior performance and reliability in comparison to Ge-DGTFET, even under the influence of ITC at the Al2O3/Ge interface. Therefore, the CP-Ge-DGTFET device structure is a sturdy contender for Analog/RF and low-power switching applications.