Abstract
The way of improving the thickness uniformity of the thin film deposited by magnetron sputtering system is presented in this paper. A simple model for the magnetron sputtering system with a baffle between cathode target and substrate is described. Based on this model, it is possible to predict the relative deviation of film thickness with this baffle-model by taking the shape and size of baffle into the consideration. The purpose of this article is to explain how different baffle parameters affect the uniformity of thin film using the method of finite element with rectangle target in this magnetron system. It is found that there may exist optimum baffle conditions where the relative deviation of thin film thickness is less than 3 % with a diameter of Φ 150 mm substrate.
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