Analysis of film thickness for magnetron sputtering system with more than one workbench

Abstract

ABSTRACT In this article, the thickness uniformity of thin films deposited by magnetron sputtering system involved in both planetary circumrotate model and traditional model by rectangle target were investigated respectively. It was shown that the thickness uniformity of films by magnetron sputtering system with rotation and revolution at the optimum ratio value of Wz/Wg 0.5 is superiority to traditional system which with 0. 3 of thickness relative deviation at coordinative condition. Moreover, the relative deviation was dropped as the addition of distance from substrate to target. The results were in accord with that obtained experimentally. Keywords: Magnetron sputtering, thickness uniformity of film , the ratio of rotation speed to revolution speed 1. INTRODUCTION Magnetron sputtering is one of the important methods to prepare various kinds of films, such as metal, semiconductor and insulator films. The film thickness uniformity is a crucial factor for optical an d electrical applications