Abstract

We report indirect measurements of thermal conductivity in silicon nanostructures. We have exploited a measurement technique based on the Joule self-heating of silicon nanowires. A standard model for the electron mobility has been used to determine the temperature through the accurate measurement of the nanowire resistance. We have applied this technique to devices fabricated with a top-down process that yields nanowires together with large silicon areas used both as electrical and as thermal contacts. As there is crystalline continuity between the nanowires and the large contact areas, our thermal conductivity measurements are not affected by any temperature drop due to the contact thermal resistance. Our results confirm the observed reduction of thermal conductivity in nanostructures and are comparable with those previously reported in the literature, achieved with more complex measurement techniques.

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