Abstract
Ultrafine-grained Zn (UFG-Zn) with the grain size of about 200nm was processed by Spark Plasma Sintering at 300°C from fine Zn powder. The grain boundaries in the consolidated material were decorated by ZnO dispersoids with a mean thickness of ~20nm. The creep behavior was studied by indentation tests in the homologous temperature range of 0.87–0.91. The activation energy of the creep for UFG-Zn was found to be much larger (211–252kJ/mol depending on the oxide content) than the value determined previously for coarse-grained Zn (152–159kJ/mol). The activation energy increased with increasing ZnO content in UFG-Zn. X-ray line profile analysis revealed that the population of the different dislocation slip systems changed during creep deformation, indicating a considerable dislocation activity.
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