Abstract
Creep behavior of the ternary Sn-5Sb-1.5Ag and Sn-5Sb-1.5Bi alloys was studied by indentation testing at 298 and 370 K, and compared to that of the binary Sn-5Sb base alloy. Among all tested materials, as indicated by their minimum creep rates, Sn-5Sb-1.5Bi showed the highest creep resistance followed by Sn-5Sb-1.5Ag and Sn-5Sb. The superiority of the Bi-containing alloy is mainly due to the microstructural refinement and solid solution hardening effects of Bi in the Sn matrix, while the improvement in the creep resistance of the Ag-containing alloy is caused by the formation of spherical and rod-shaped Ag3Sn particles. The stress exponent values in the range 11.0–12.2 are close to those determined by tensile and impression creep testing of the same alloys reported in the literature. These high stress exponents together with the activation energies of 58–70 kJ/mol may suggest that the dominant creep mechanism is dislocation creep.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call