Abstract
Nothing is more important these days in electronic industry than lead-free soldering. This is not only important but also a 'must' due to legislation. We had plenty of time to get acquainted with the SnPb solder but less for the new 'challenge'. Assemblers are forced by the component manufacturers to use different kind of alloys, surface finishes and component coatings. Separation of these materials is very difficult and nearly unsolvable. This is the main issue in lead-free soldering. Actually when the assemblers changing to the lead-free soldering technology, it can happen that they use leaded and lead-free materials together. In most cases this is not the fault of their own, because the component manufacturers often do not mark the type of the coating on the part. The use of some leaded and lead-free soldering materials together in wrong combinations may lead to bond degradation. (3), (4)
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