Abstract
The present work investigates the approach of the in-situ investigation of the microstructure of electrolytic deposited metal layers by using a conventional x-ray diffractometer. The used electrochemical x-ray cell used allows the reduction of the electrolytic film thickness during the x-ray diffraction to avoid a significant reducing of intensity caused by diffuse scattering. The results reveals the microstructure development of copper layers depending on the layer thickness and the deposition potential. The avoidance of any contamination with an ambient atmosphere and the continuously potential control guarantees steady conditions of the sample surface between the deposition steps and during the diffraction measurement.
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