Abstract
Vapor phase cleaning of Si(100) surface in a cluster tool was studied. Electrical properties of the interface and the integrity of 55 Å films formed by in situ pregate oxide cleaning and rapid thermal oxidation (RTO) were characterized. Pregate oxide cleaning included anhydrous hydrofluoride (AHF) vapor for etching of native or sacrificial oxide, hydrocarbon removal, and trace metallic contamination elimination. Compared with a conventional wet cleaning procedure, in situ cleaning results in an equivalent interface and film with higher charge‐to‐breakdown . A two‐step cleaning procedure consisting of AHF etching and metal removal results in oxides with the highest .
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