Abstract
We describe a technique for ultra-high-vacuum compatible deposition of structures on flat substrates. This technique allows one to form micrometer and even submicron-sized structures on a flat surface with minimal contamination. It also has the advantage of producing a smooth edge profile similar to those achieved using a two-layered resist.
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Schedule a callMore From: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
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