Abstract
A new poly(imide siloxane)/tantalum oxide (PIS/TaO x) hybrid material has been successfully fabricated through the in situ formation of TaO x within a PIS matrix by sol–gel process. The hybrid thin films are prepared from 4,4-oxydiphthalic anhydride (ODPA), 2,2-bis[4-(4-aminophenoxy)phenyl]propane ( p-BAPP), α,ω-bis(3-amnopropyl)polydimethyl siloxane (APPS) and p-aminophenyltrimethoxysilane (APTS). The coupling agent APTS is employed to provide covalent bonding between the PIS and the TaO x and to control the block chain length of poly(amic acid siloxane). The effect of TaO x content in the PIS/TaO x hybrid thin films on surface characteristics, thermogravimetric analysis, thermal expansion coefficient, dynamic mechanical properties and the adhesion strength between the PIS/TaO x hybrid films and copper foil are investigated. The presence of TaO x on the hybrid film surface can improve the adhesion strength between the PIS/TaO x hybrid film and copper foil. Furthermore, by incorporating TaO x into the PIS matrix, the PIS/TaO x hybrid film possesses lower thermal expansion coefficient and retains good mechanical and thermal properties as well.
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