Abstract

AbstractA new application of the electrochemical method, in situ chronoamperometry, has been developed and used as a tool for CMP slurry characterization. The measured current response, i, resulting from a small applied potential is fit to an exponential equation, i = io + A1exp(-t/tD). The fitting parameters serve as a measure of surface reactivity (io), surface film robustness (A1), and the kinetics of film formation (tD). A description of the method and correlations to polishing performance are discussed in this paper.

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