Abstract
This article present an instrument applicable to in-process measurement of surface roughness. In the process a grinding machine is used. In the first experiment surfaces in the roughness area of 0/09 μm ≤ R a≤0.06 μm were measured, in the second 3.0 μm ≤ R a≤3.4 μm. The method presented here is generally applicable, i.e., more rough surfaces can be measured if a laser with appropriate wavelength and a detector sensitive to that wavelength is chosen.
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