Abstract

Lock-in thermography was applied to the measurement of the in-plane thermal diffusivity of three polyethersulfone (PES) textiles characterized by different weaving pattern as well as different mass density of interlacing fibers. The experimental results showed that the in-plane thermal diffusivity in each direction decreased with the increase of the fibers’ linear mass density, thus leading to an anisotropic behavior of the thermal diffusivity in the specimen where PES fibers with different density were interlaced. A new theoretical model for the study of the heat diffusion in textiles was specifically developed and, thereafter, employed for the analysis of the experimental results. As such, our textile model approach, shedding light on the role of different textile and fibers parameters on the resulting thermal diffusivity, paves the way for the development and design of textiles with tailored thermal behavior.

Highlights

  • Over the recent period, there has been growing interest in knitted fabrics for the realization of electrically driven functional fabrics, so-called smart textiles

  • As regards the production of textile antennas, different fabric materials such as cotton, polyester and nylon are typically employed for the realization of the substrate, while copper adhesive tape, silver conductive ink or conductive paper are usually adopted as radiating materials, to name some [4,5]

  • The infrared thermography (IRT)-LIResults phase signal vs. lateral distance for PES1 and PES3 samples are reported in Figure 4a,b, respectively, where the insets display the corresponding phase contour maps

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Summary

Introduction

There has been growing interest in knitted fabrics for the realization of electrically driven functional fabrics, so-called smart textiles Such an interest is due to several technological advances such as the emergence of conductive and elastic yarns for stretchable electronics, the development of conductive inks as well as advances in miniaturization and printing techniques. In this respect, special attention has been devoted to the development of flexible patch antennas and electronics for wearable telemedicine and defense applications [1,2,3], as well as power-assisted garments for personal thermal management. Several problems remain unsolved and, among others, the dissipation of the heat produced by the integrated electronic devices through the substrate textile is among the most important issue, which still deserves further studies in order to optimize the effective thermal diffusivity and infrared emissivity of these structures [6,7,8]

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