Improving the interfacial bonding strength of a silane anticorrosion film on copper surfaces using small-molecule corrosion inhibitors

Abstract

The weak binding ability of silane to copper surfaces restricts its use in copper anticorrosion. In this study, the P–OH groups in etidronic acid (HEDP) were utilized to establish chemical bonds with copper and to react with 3-mercaptopropyltrimethoxysilane (PropS-SH), serving as a bridging mechanism to enhance the anchoring of silane onto copper surfaces. Moreover, the presence of HEDP promoted the condensation of silane, leading to the formation of a denser and thicker film with outstanding corrosion resistance. SEM results indicated that the thickness of the PropS-SH/HEDP film was about 125 nm, and defects at the copper–film interface were repaired. Electrochemical tests demonstrated that the PropS-SH/HEDP film exhibited remarkable corrosion resistance, achieving an anticorrosion efficiency of 99.95 %. Immersion testing showed that the PropS-SH/HEDP film was capable of withstanding immersion in a 3.5 wt% NaCl solution for 10 days, displaying a durability 5 times greater than that of the standalone silane film.