Abstract
The article presents the results confirming the improvement of electrical characteristics of a hybrid integrated circuit (HIC) of the microwave generator module on coaxial dielectric resonator (CDR) at the expense of improving the design and using a 3D volumetric packaging to place elements and components of the circuit in the volume of a multilayer printed circuit board and a metal case. The advantages of such a HIC design and the explanation of the reasons for improving the electrical and weight and size characteristics are given.
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