Abstract
The influence of Ni on the grain orientation of Sn-3.0Ag-0.5Cu-xNi (wt.%; x = 0, 0.05, 0.1)/organic solderability preservative (OSP) Cu solder joints and reliability of slow speed under shear test with and without aging were investigated. The interlaced structure was revealed in Ni-doped solder joints by employing a scanning electron microscope-based electron backscatter diffraction. Apart from that, with the aid of a multiple functions tester (Xyztec Sigma), Ni-doped solder joints were revealed to be more reliable under slow speed shear tests before and after aging. The enhancement of shear strength of solder joints was attributed to the modified microstructure caused by minor Ni addition. The present work explored that with slight Ni doping in solder joints, the mechanical reliability of advanced electronic packaging was improved.
Published Version
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