Abstract
Smart phone market has been growing larger and larger in recent years. This fact makes enormous competitiveness in its supply chain. Therefore, the product quality is the most importance part to improve business competitiveness, especially a flexible printed circuit which is a main assembly component in smart phones. This paper presents the approach to improve the quality control plan of the flexible printed circuit backend process. Failure Mode Effective Analysis (FMEA) was adopted to prioritize the defective and analyze weak points in the original quality control plan. Then, Statistical Process Control (SPC), optimizing inspection method and working procedure of inspection process, were introduced to improve the detection ability of the quality control plan. The results showed that the implementation of the new quality control plan could reduce escaped defective parts and the expense of escaped defect parts significantly.
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