Abstract

A novel method for fabricating the base metal Cu in an air atmosphere was successfully developed based on thick film screen printing of Al pastes and galvanic replacement reactions. The first thick film screen printed Cu electrode with high conductivity (<10−6 Ω-cm), which is comparable to thick film Ag electrode, was successfully made in air firing instead of reducing atmosphere firing.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call