Abstract
The Diamond/SiC composites were fabricated via slip casting and chemical vapor infiltration (CVI) approaches. The effects of diamond particle size (50–500μm) on microstructure, flexural strength, density, fracture toughness and thermal conductivity of Diamond/SiC composites were discussed. By using large-sized diamond particles, thermal conductivity of composites can be improved and the maximum value could reach up to 241W/(m·k), which is 2.1 times higher than that of the Diamond/SiC composites prepared by tape-casting and CVI process. With increasing of diamond particle size, the density of Diamond/SiC composites increased, and the mechanical properties decreased. The maximal density, flexural strength and fracture toughness were 3.18g/cm3, 287MPa and 5.0MPa·m1/2 respectively. The fracture mechanism of the composites transferred from diamond particles transgranular fracture to interfacial debonding.
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