Improvement of wettability and tensile property in Sn–Ag–RE lead-free solder alloy

Abstract

The influence of mixture (La, Ce) rare earth elements (RE) on wettability and tensile property in Sn–3.5Ag solder alloy was investigated. The wetting property was improved by 0.25–0.5% addition of (La, Ce) rare earth elements into the Sn–3.5Ag solder alloy, while over addition of the rare earth elements up to 1.0 wt.% reduced the beneficial influence. The ultimate strength and ductility were also enhanced by 0.25–0.5% addition of (La, Ce) rare earth elements, while the change of melting temperature was negligible.