Abstract
In the study reported herein, silver-coated copper (Ag/Cu) powder was modified with alkanethiols featuring alkyl chains of different lengths, namely butyl, octyl, and dodecyl, to improve its thermal stability. The modification of the Ag/Cu powders with adsorbed alkanethiols was confirmed by scanning electron microscopy with energy dispersive spectroscopy, X-ray photoelectron spectroscopy, and thermogravimetric analysis. Each powder was combined with an epoxy resin to prepare an electrically conductive film. The results confirmed that the thermal stability of the films containing alkanethiol-modified Ag/Cu powders is superior to that of the film containing untreated Ag/Cu powder. The longer the alkyl group in the alkanethiol-modified Ag/Cu powder, the higher the initial resistance of the corresponding electrically conductive film and the lower the increase in resistance induced by heat treatment.
Highlights
Conductive adhesives are widely used in the fabrication of electronic devices and mechanical attachments, and generally consist of a polymer matrix and conductive metal fillers
It is well known that spherical applied more extensively thanAg-coated Cu (Ag/Cu) powder particles are suitable for anisotropic conductive adhesives, and Ag/Cu flakes are suitable for isotropic conductive adhesives [23, 24]
4 Conclusions In order to improve the thermal stability of dendritic Ag/ Cu powders, the surfaces of the Ag/Cu powders were modified with alkanethiols featuring alkyl chains of different lengths
Summary
Conductive adhesives are widely used in the fabrication of electronic devices and mechanical attachments, and generally consist of a polymer matrix and conductive metal fillers. The electrical performance of an electrically conductive, epoxy-based adhesive containing 20 vol% Ag/Cu powder with a Ag content of 15 % remains relatively steady. Studies have revealed that the electrical properties of a Cu-containing electrically conductive adhesive change under pressure [18] and the distribution of Ag on the surface of Ag-coated Cu particles, determined by the Ag content and coating process, directly affects the degree of oxidation observed [19]. These research results have informed the analytical and chemical study of the behavior of Ag/Cu powder in epoxy-based adhesives [25]. The surfaces of dendritic Ag/Cu powders were modified with self-assembling alkanethiols. Epoxy-based composite films containing the Ag/Cu powders modified with alkanethiols featuring different alkylchain lengths were prepared to investigate their thermal stability and electrical resistance
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