Abstract
We investigated a mechanism of improving adhesiveness depending on sintering temperature for printed silver (Ag) electrodes prepared from nanoparticle ink on an insulating polymer layer as the under layer. The adhesion strength significantly improved by sintering the Ag electrodes at a temperature above the glass transition temperature (Tg) of the polymer layer. In the sample with improved adhesiveness, the interfacial fusion between the printed Ag electrodes and polymer layer was observed in a cross sectional scanning electron microscope image. Based on this mechanism, we have successfully demonstrated the improvement in mechanical durability of organic thin-film transistors (TFTs) with printed Ag electrodes. The degradation of the organic TFTs after applying bending stress was significantly suppressed by interfacial fusion.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
