Abstract
This paper presents a verification of technology aspects for improvement of field effect capacity type gas sensor parameters by using laser micromilling technique for fabrication ceramic surface mounting device (SMD) package and microheater for sustentation working temperature of metal-insulator-semiconductor structure (MIS structure). Innovative claims include: demonstration of flexible opportunities for new digital fabrication process flows based on laser micromilling tech: fast design of SMD sensor 3-D model, flexible changing topology of microheater, thick and thin film technology combination for reducing of power consumption. The results show possibility to fast fabrication functional sensor in customer ceramic SMD package with base 9x9 mm with twice reduced power consumption and improving mechanical properties compare with classical metal-glass microelectronic packages using before for such type sensors.
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