Abstract
Micro-patterned PDMS film was fabricated and combined with LED chip on board (COB) package to improve the emission uniformity of LED chip. The micro scale patterned sapphire substrate (PSS) was used as a mold to fabricate micro-cone patterned PDMS (MC-PDMS) film. A strong scattering effect from this MC-PDMS film can be verified by the high haze ratio and the Bi-directional Transmission effect. The angle dependent color temperature measurement system was used to measure the ΔCCT of COB with and without MC-PDMS. The measurement results indicate that the ΔCCT was reduced from 1025K to 428K. This improvement can effectively eliminate the yellow ring effect of LED chip. This technology can be thus considered as a cost-effective way for the next generation of light source packages.
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